Hi

Time-critical message for serious VLSI students:

Registration for our Advanced Chip Packaging workshop closes in 6 hours - and these are the final 2 cohorts we're running this quarter.

Why this matters right now:

• TSV (Through-Silicon Via) technology is becoming standard in 2.5D/3D integration
• Companies are hiring packaging specialists at 30% premium salaries
• Next hiring cycle begins soon - this workshop prepares you for those interviews

What you lose if you wait:
❌ Hands-on TSV and interposer design techniques
❌ Real 2.5D packaging case studies from industry
❌ Direct access to packaging experts for career guidance
❌ Competitive edge in upcoming campus placements

This is not just another course - this is the specific knowledge gap that separates candidates who get hired from those who don't.

⏰ Final Registration: https://www.vlsisystemdesign.com/packaging/

Don't be the student who says "I wish I had enrolled" when packaging questions come up in your next interview.

—
Team VSD

P.S. The 6-hour clock is ticking. The companies hiring for these roles aren't waiting - why should you?