Hi
Moore's Law is hitting walls, but Apple's M-series chips keep getting faster. NVIDIA's AI processors crush benchmarks. How?
They're not just designing better transistors—they're
orchestrating multiple chips like a symphony.
What you're missing in your coursework:
- How TSVs (through-silicon vias) let chips "talk" through silicon
- Why interposers are the secret sauce in high-performance computing
- Where 3D stacking creates performance leaps that Moore's Law can't
This isn't abstract theory. This is what separates
entry-level engineers from architects at Intel, AMD, and Tesla.
Workshop: Advanced Chip Packaging
We break down exactly how 2.5D/3D integration works—with real silicon examples you can't find in textbooks.
The companies winning in semiconductors aren't just the ones with the best transistor technology—they're the ones with the best packaging technology.
If you want to design chips that actually get built, this is non-negotiable knowledge.
Enroll here → https://www.vlsisystemdesign.com/packaging/
No fluff. Just the technical edge you need.
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Regards
VLSI System Design
P.S. The next time someone says "Moore's Law is dead," you'll be able to explain what actually comes next
