Hi
The discussions at SEMICON India 2025 made it clear: the true engineering challenge has shifted from transistor scaling to system-level integration.
The future belongs to those who can solve the complex problems of:
- Thermal Management in 3D stacked dies.
- Signal and Power Integrity in
heterogeneously integrated systems.
- Mechanical Stress in advanced packages using materials like Silicon Carbide (SiC).
- Co-designing architectures across multiple chiplets.
This is not just assembly. This is where systems are architected for performance.
We are closing registration for the Advanced IC Packaging Workshop
in 12 hours. This is a hands-on, technical deep dive designed for engineers who want to move from concept to simulation.
What you will technically accomplish:
- Model and analyze thermo-mechanical stress in a 3D IC stack using ANSYS.
- Design and optimize interconnect layouts for signal integrity.
- Gain proficiency in the commercial EDA
toolflows (Cadence, Siemens) used for co-designing chips and packages.
- Build a complete project that demonstrates your ability to tackle the integration challenges highlighted at SEMICON.
This is your opportunity to move beyond theory and gain command of the tools and methodologies that are defining the next decade of semiconductor innovation.
The window to develop these critical skills and apply them to the next generation of Indian semiconductor projects is closing.
Secure your technical edge here (Closes in 12 hrs):
https://www.vlsisystemdesign.com/packaging/
Build the future. Solve the hard problems.
Best regards,
The VSD Team
*P.S. This workshop is for those who are genuinely motivated by the technical hurdles of integration, not just the
career opportunity. If you are curious about how to actually simulate heat dissipation in a 3D stack or optimize a substrate for high-speed signals, this is your final call to join.*