Hi
We are pleased to announce a joint initiative by NASSCOM, IIT Gandhinagar, Ansys, and VLSI System Design (VSD): the Advanced Semiconductor Packaging Workshop. This program combines academic rigor, industry-grade tools, and
corporate mentorship to equip you with skills critical to the future of semiconductor design.
Why Semiconductor Packaging is the Next Frontier for Engineers:
- High Demand: The global packaging market is projected to reach $65B by 2030 (Yole Group). Companies like Intel, TSMC, and Micron prioritize engineers skilled in 3D-IC integration, thermal management, and signal
integrity.
- Innovation-Driven: Packaging now defines chip performance in AI, 5G, and electric vehicles. Emerging trends like chiplets, Water-on-Water (WoW) stacking, and AI-driven thermal optimization are reshaping the industry.
- Career Growth: Packaging engineers command 20-30% higher salaries than traditional VLSI roles due to niche expertise in multi-physics simulations and heterogeneous integration.
Why Enroll in This Workshop?
- Hands-On Ansys Training: Master thermal simulation (Icepak) and 3D-IC modeling (Q3D) — tools used by leading semiconductor firms.
- IIT Gandhinagar’s Expertise: Learn cutting-edge research in thermal dynamics and material science from faculty at a premier institute.
- NASSCOM Industry Connections: Showcase your skills to recruiters from Tata Electronics,
AMD, and other industry leaders.
- VSD’s Project-Based Labs: Complete timestamped, industry-mirrored tasks to earn certification — a proven metric for recruiters.
Program Structure:
- 10-day intensive labs simulating real-world R&D workflows (24/7 access).
- Design Flip-Chip BGAs, optimize bondwire layouts, and analyze thermal hotspots.
- Certification awarded only
upon successful lab completion.
Enrollment Link: Register Here - https://www.vlsisystemdesign.com/packaging/
Best Regards,
Team NASSCOM-VSD
Collaborating
Partners:
- IIT Gandhinagar: Research leadership in thermal/material challenges.
- Ansys: Industry-standard simulation tools and certification.
- NASSCOM: Connects learners to semiconductor hiring networks.
- VSD: Delivers corporate-aligned labs and mentorship.
P.S. Early enrollment recommended.
Tools: Ansys Icepak, Q3D | Partners: IITGN, Ansys, NASSCOM, VSD
