Hi
Your expertise in physical design is what gets the chip taped out. But in the eyes of the industry, a designer whose understanding stops at the GDSII is a liability.
Why?
Because without understanding packaging, you are
designing in a vacuum. You are making floorplanning, I/O placement, and power network decisions that:
- Force the use of a more expensive package because your bump map is inefficient.
- Create signal integrity nightmares that couldn't be predicted at the die level.
- Cause the final product to overheat because you didn't co-design for thermal dissipation.
These aren't packaging problems. They
are your problems, manifesting after tapeout.
The difference between a good engineer and a lead architect is system-level mastery. Packaging is the critical link between your silicon and the product.
This is your final opportunity to close that knowledge gap.
Registration for our intensive workshop "Chip Packaging for
the Physical Designer" closes in 12 hours.
This isn't a theoretical overview. It's a practical, hard-skills session that will show you exactly how your PD decisions impact packaging, cost, and performance.
In 12 hours, this door closes. The engineers who register are the ones making a strategic decision to become irreplaceable.
You can either continue being the designer who hands off a design and hopes for the best, or you can become the engineer who owns the product's success from RTL to final package.
The choice is yours.
>> Register Now: www.vlsisystemdesign.com/packaging/
This is the last email you'll receive from us about this.
Best regards,
The Team at VLSI System Design
