Hi
Tomorrow at 11:59 PM IST the doors close on our “Silicon‑to‑System Packaging” weekend workshop - and I don’t want you to miss what hundreds of engineers are calling the quickest way to turn “I’ve heard of TSVs” into “I can model the thermal stack myself.”
Why this one matters right now
- Hottest skill in semiconductors. Foundries are booked, node shrinks are slowing, and the innovation race has shifted to advanced packaging. Companies need engineers who understand bump‑pitch, warpage and HAST as fluently as RTL.
- Built for busy professionals. Five razor‑focused modules—design → assembly → thermal → reliability → 3‑D
extraction—delivered over one intense weekend with lab files you keep forever.
- See it, then do it. You’ll replicate a real flip‑chip BGA thermal run on your laptop (ANSYS Icepak license provided for the session) and walk away with a report you can show in Monday’s meeting.
- Industry‑grade material. Every slide comes straight from factory floors and failure‑analysis labs—no recycled conference decks.
“I finally understood why a 0.05 °C/W error can blow an entire BOM. This workshop felt like four semesters condensed into two days.”
—Past participant
How to grab a seat
- Click the registration link: https://www.vlsisystemdesign.com/packaging
- Complete the short form—takes less than two minutes.
- You’ll receive pre‑work files and Zoom credentials on the day of the program.
Deadline: 11:59 PM IST, 31 July 2025.
Late registrations can’t be accepted because licenses are issued tomorrow night.
See you in
the (virtual) cleanroom.
Best regards,
Kunal Ghosh
Founder, VLSI System Design (VSD)
