Hi

The semiconductor industry is evolving fast. While Physical Design and STA remain core skills, Semiconductor Packaging is where real-world challenges begin.

Industry reports project that by 2030, over 30% of chip design jobs will require packaging knowledge, driven by advanced technologies like 2.5D/3D ICs, chiplets, and heterogeneous integration.

Packaging engineers are no longer assembly-line workers—they are system architects, working on:

• Signal integrity optimization
• Power delivery network (PDN) planning
• Thermal management of high-density dies
• 3D EM simulations of interconnect parasitics

If you want to be part of this next-gen workforce, the time to start is now.

✅ Last 8 cohorts of our hands-on Semiconductor Packaging Workshop are open for registration—closing in 13 hours.

This workshop teaches you how to model real-world packaging elements like bondwires, die-attach, and substrate layers, using industry-grade simulation flows.

You’ll gain skills that companies are actively hiring for, across design, testing, and manufacturing roles in the semiconductor domain.

👉 Register now before it closes:
https://www.vlsisystemdesign.com/packaging/

Prepare today for careers that will dominate the chip design landscape tomorrow.