Hi
The semiconductor industry is evolving rapidly, and advanced packaging has emerged as a critical enabler of next-gen technologies—from AI accelerators to IoT devices. If you’re looking to position yourself at the forefront of this transformation, the Semiconductor Packaging Workshop by VLSI System Design offers a unique, hands-on pathway to build expertise in this high-growth domain.
Why this workshop?
The program emphasizes practical, industry-aligned learning, as evidenced by lab reports
like this thermal and structural analysis of a semiconductor package. Participants gain proficiency in Ansys tools, simulating real-world challenges such as warpage, thermal management, and signal integrity—skills directly applicable to R&D and product development roles.
The future of Semiconductor Packaging jobs in India
With India’s semiconductor market projected to reach $55 billion by 2026 (ISA & Counterpoint), the demand for packaging design engineers is surging. Companies like Micron, Tata, and global OSATs are scaling operations, while government initiatives (e.g., SEMI India, DLI) aim to build a skilled workforce. Yet, talent in advanced packaging remains scarce. Early-career engineers who upskill now will have a
first-mover advantage in roles spanning:
- Heterogeneous integration (chiplets, 3D-IC)
- Thermal/mechanical reliability engineering
- Signal/power integrity analysis
Why should you care?
- High-impact niche: Packaging is no longer an afterthought—it’s pivotal to performance, power, and miniaturization.
- Interdisciplinary relevance: Whether you’re in VLSI,
mechanical, or materials engineering, packaging intersects with your domain.
- Career resilience: As fab and design investments grow in India, packaging expertise will be a differentiator in R&D, product engineering, and manufacturing roles.
Even if you don’t specialize immediately, understanding packaging workflows (system-in-package, fan-out technologies) is increasingly valuable for architects, validation engineers, and system
designers.
Act now—registration closes in 24 hours
This is your last chance to join a cohort of engineers preparing for India’s semiconductor boom. The workshop’s structured labs, industry case studies, and tool training (Ansys) provide a competitive edge for internships, core engineering roles, and R&D positions.
Enroll Here | Deadline: 10th April (tomorrow) 11:59pm IST
Don’t miss this opportunity to future-proof your career in a field where innovation meets high demand.
Best regards,
VSD Team
PS: Questions? Reply to this
email—we’re happy to help you decide if this program aligns with your goals.
