Last 12 Hours: Master Thermal Analysis for Chip Packaging (BGA Case Study Inside)

Published: Thu, 03/27/25

Updated: Thu, 03/27/25

Here’s why your chip packaging designs might fail:
A poorly optimized Ball Grid Array (BGA) can overheat, crack, or degrade performance—like the thermal simulation below showing a dangerous 33°C hotspot (ambient: 20°C):

BGA Temperature Distribution
Simulation Results: Temperature gradients in a BGA package (Max: 33°C, Min: 20°C).

This is exactly what we’ll teach you to fix in NASSCOM, Ansys, IITGN & VSD’s workshop before registrations close in 12 hours:

Thermal analysis fundamentals: Predict hotspots using Ansys tools.
Design optimization: Reduce gradients (like 33°C → 25°C) to prevent failures.
Industry workflows: Validate packaging for reliability, just like Intel or Samsung.

Why act now?

Last chance to join: Next cohort opens in 2025.
Live demo access: Replicate this BGA simulation yourself.
Career edge: Thermal engineers earn 30% more in semiconductors.

👉 Enroll Now → https://www.vlsisystemdesign.com/packaging/

P.S. Top 20 registrants get a certification on “Solving Signal Integrity in High-Temp BGAs” which will be shared with industry. Will you make the cut?

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